Job Description

Role: Selection/design/implementation of assembly processes covering standard machines and bespoke equipment built in the UK and abroad Areas of Responsibility: 1. Solder Print 2. Solder Reflow 3. Wave/Selective Solder 4. Rework technology 5. Lead Free Implementation 6. Design For Manufacture and Assembly 7. New product Introduction


Key Activities: 1. Ownership/Continuous improvement of existing machines/processes 2. Selection of new assembly process/techniques 3. Design/Development of new tooling for new/existing processes 4. Selection/liaison with Suppliers for both standard and bespoke equipment 5. Implementation of Lead Free Soldering 6. Liason with other departments 7. Use of Six Sigma Techniques in improving activities 8. Selection of rework techniques/technology 9. Project management of machine/process introduction including: - Design of Experiments PMT-X studies Implementation of 11 colours Ownership of PFMEA Capital expenditure Cycle time Costings Delivering high yields



Education/Qualification Required: Minimum of HNC/HND standard. Degree standard in a science discipline (physics/chemistry) preferred.



Experience Required 5 years experience Experience of assembly process engineering in electronic manufacturing is essential Lead Free processing knowledge

Qualifications/Skills Required

process engineer lead free soldering surface mount